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1 Ergebnisse
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Coverage and reliability improvement of copper metallizatio..:
Zhu, Kai
;
Xing, Ruimin
;
Jiang, Zhongming
...
REVIEWS ON ADVANCED MATERIALS SCIENCE. 63 (2024) 1 - p. , 2024
Link:
https://doi.org/10.1515/rams-2023-0163
RT Journal T1
Coverage and reliability improvement of copper metallization layer in through hole at BGA area during load board manufacture
UL https://suche.suub.uni-bremen.de/peid=cr-10.1515_rams-2023-0163&Exemplar=1&LAN=DE A1 Zhu, Kai A1 Xing, Ruimin A1 Jiang, Zhongming A1 Zhong, Rongjun A1 Chen, Liuming A1 Liu, Jianhui A1 Miao, Hua A1 Zhou, Guoyun PB Walter de Gruyter GmbH YR 2024 SN 1605-8127 JF REVIEWS ON ADVANCED MATERIALS SCIENCE VO 63 IS 1 LK http://dx.doi.org/https://doi.org/10.1515/rams-2023-0163 DO https://doi.org/10.1515/rams-2023-0163 SF ELIB - SuUB Bremen
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