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A novel in-field TSV repair method for latent faults:
Tianming, Ni
;
Hao, Chang
;
Haochen, Qi
.
IEICE Electronics Express. 15 (2018) 23 - p. 20180873-20180873 , 2018
Link:
https://doi.org/10.1587/elex.15.20180873
RT Journal T1 <Title>A novel in-field TSV repair method for latent faults</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1587_elex.15.20180873&Exemplar=1&LAN=DE A1 Tianming, Ni A1 Hao, Chang A1 Haochen, Qi A1 Zhengfeng, Huang PB Institute of Electronics, Information and Communications Engineers (IEICE) YR 2018 SN 1349-2543 JF IEICE Electronics Express VO 15 IS 23 SP 20180873 OP 20180873 LK http://dx.doi.org/https://doi.org/10.1587/elex.15.20180873 DO https://doi.org/10.1587/elex.15.20180873 SF ELIB - SuUB Bremen
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