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Monitoring method of solder layer void damage of IGBT modul..:
Huang, Xiyuan
;
Sun, Xiepeng
;
Wang, Gengji
..
IEICE Electronics Express. 21 (2024) 12 - p. 20240243-20240243 , 2024
Link:
https://doi.org/10.1587/elex.21.20240243
RT Journal T1
Monitoring method of solder layer void damage of IGBT module based on transfer function
UL https://suche.suub.uni-bremen.de/peid=cr-10.1587_elex.21.20240243&Exemplar=1&LAN=DE A1 Huang, Xiyuan A1 Sun, Xiepeng A1 Wang, Gengji A1 Yin, Jinliang A1 Du, Mingxing PB Institute of Electronics, Information and Communications Engineers (IEICE) YR 2024 SN 1349-2543 JF IEICE Electronics Express VO 21 IS 12 SP 20240243 OP 20240243 LK http://dx.doi.org/https://doi.org/10.1587/elex.21.20240243 DO https://doi.org/10.1587/elex.21.20240243 SF ELIB - SuUB Bremen
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