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1 Ergebnisse
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Failure Behavior of Electroplated Co60Ru40 layer on NiSix/S..:
Tseng, Jiun Yi
;
Chen, Wen Jauh
;
Wu, Kuan Chen
International Journal of Electrochemical Science. 16 (2021) 11 - p. 211132 , 2021
Link:
https://doi.org/10.20964/2021.11.27
RT Journal T1 <Title>Failure Behavior of Electroplated Co60Ru40 layer on NiSix/Si Substrate for Copper Metallization</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.20964_2021.11.27&Exemplar=1&LAN=DE A1 Tseng, Jiun Yi A1 Chen, Wen Jauh A1 Wu, Kuan Chen PB Elsevier BV YR 2021 SN 1452-3981 JF International Journal of Electrochemical Science VO 16 IS 11 SP 211132 LK http://dx.doi.org/https://doi.org/10.20964/2021.11.27 DO https://doi.org/10.20964/2021.11.27 SF ELIB - SuUB Bremen
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