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Reliability Simulation with the Finite Element Analysis (FE..:
Okada, Yuji
;
Fujii, Atsushi
;
Ono, Kenta
.
Journal of Photopolymer Science and Technology. 33 (2020) 2 - p. 171-176 , 2020
Link:
https://doi.org/10.2494/photopolymer.33.171
RT Journal T1 <Title>Reliability Simulation with the Finite Element Analysis (FEA) of Redistribution Layer in Fan-out Wafer Level Packaging</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.2494_photopolymer.33.171&Exemplar=1&LAN=DE A1 Okada, Yuji A1 Fujii, Atsushi A1 Ono, Kenta A1 Kariya, Yoshiharu PB Technical Association of Photopolymers, Japan YR 2020 SN 0914-9244 SN 1349-6336 JF Journal of Photopolymer Science and Technology VO 33 IS 2 SP 171 OP 176 LK http://dx.doi.org/https://doi.org/10.2494/photopolymer.33.171 DO https://doi.org/10.2494/photopolymer.33.171 SF ELIB - SuUB Bremen
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