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1 Ergebnisse
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Assembly Technology for 3D-MID:
, In:
Three-Dimensional Molded Interconnect Devices (3D-MID)
,
Pfeffer, M.
- p. 113-135 , 2014
Link:
https://doi.org/10.3139/9781569905524.004
RT T1 <cTitle>Three-Dimensional Molded Interconnect Devices (3D-MID)</cTitle>: T1 <Title>Assembly Technology for 3D-MID</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.3139_9781569905524.004&Exemplar=1&LAN=DE A1 Pfeffer, M. PB Carl Hanser Verlag GmbH & Co. KG YR 2014 SP 113 OP 135 LK http://dx.doi.org/https://doi.org/10.3139/9781569905524.004 DO https://doi.org/10.3139/9781569905524.004 SF ELIB - SuUB Bremen
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