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1 Ergebnisse
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Microstructural Analysis of Solder Bump Fabricated by Sn El..:
Kim, Sang-Hyeok
;
Kim, Seong-Jin
;
Shin, Han-Kyun
...
Korean Journal of Metals and Materials. 59 (2021) 4 - p. 233-238 , 2021
Link:
https://doi.org/10.3365/kjmm.2021.59.4.233
RT Journal T1
Microstructural Analysis of Solder Bump Fabricated by Sn Electroplating on a PCB Substrate
UL https://suche.suub.uni-bremen.de/peid=cr-10.3365_kjmm.2021.59.4.233&Exemplar=1&LAN=DE A1 Kim, Sang-Hyeok A1 Kim, Seong-Jin A1 Shin, Han-Kyun A1 Park, Hyun A1 Heo, Cheol-Ho A1 Moon, Seongjae A1 Lee, Hyo-Jong PB The Korean Institute of Metals and Materials YR 2021 SN 1738-8228 SN 2288-8241 JF Korean Journal of Metals and Materials VO 59 IS 4 SP 233 OP 238 LK http://dx.doi.org/https://doi.org/10.3365/kjmm.2021.59.4.233 DO https://doi.org/10.3365/kjmm.2021.59.4.233 SF ELIB - SuUB Bremen
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