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1 Ergebnisse
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Low-Temperature Direct Bonding of SiC to Si via Plasma Acti..:
Wang, Fengxuan
;
Yang, Xiang
;
Zhao, Yongqiang
...
Applied Sciences. 12 (2022) 7 - p. 3261 , 2022
Link:
https://doi.org/10.3390/app12073261
RT Journal T1 <Title>Low-Temperature Direct Bonding of SiC to Si via Plasma Activation</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.3390_app12073261&Exemplar=1&LAN=DE A1 Wang, Fengxuan A1 Yang, Xiang A1 Zhao, Yongqiang A1 Wu, Jingmin A1 Guo, Zhiyu A1 He, Zhi A1 Fan, Zhongchao A1 Yang, Fuhua PB MDPI AG YR 2022 SN 2076-3417 JF Applied Sciences VO 12 IS 7 SP 3261 LK http://dx.doi.org/https://doi.org/10.3390/app12073261 DO https://doi.org/10.3390/app12073261 SF ELIB - SuUB Bremen
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