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1 Ergebnisse
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Fabrication of 30 µm Sn Microbumps by Electroplating and In..:
Na, Chang-Yun
;
Jeon, Byung-Min
;
Kim, Jong-Wook
...
Electronics. 12 (2022) 1 - p. 144 , 2022
Link:
https://doi.org/10.3390/electronics12010144
RT Journal T1
Fabrication of 30 µm Sn Microbumps by Electroplating and Investigation of IMC Characteristics on Shear Strength
UL https://suche.suub.uni-bremen.de/peid=cr-10.3390_electronics12010144&Exemplar=1&LAN=DE A1 Na, Chang-Yun A1 Jeon, Byung-Min A1 Kim, Jong-Wook A1 Jung, Woon-Seok A1 Jeong, Jae-Seong A1 Cho, Sung-Min A1 Park, Hwa-Sun PB MDPI AG YR 2022 SN 2079-9292 JF Electronics VO 12 IS 1 SP 144 LK http://dx.doi.org/https://doi.org/10.3390/electronics12010144 DO https://doi.org/10.3390/electronics12010144 SF ELIB - SuUB Bremen
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