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1 Ergebnisse
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Comparative Analysis of Thermal Properties in Molybdenum Su..:
Huang, Tzu-Jung
;
Kiebala, Tobias
;
Suflita, Paul
...
Electronics. 13 (2024) 10 - p. 1818 , 2024
Link:
https://doi.org/10.3390/electronics13101818
RT Journal T1
Comparative Analysis of Thermal Properties in Molybdenum Substrate to Silicon and Glass for a System-on-Foil Integration
UL https://suche.suub.uni-bremen.de/peid=cr-10.3390_electronics13101818&Exemplar=1&LAN=DE A1 Huang, Tzu-Jung A1 Kiebala, Tobias A1 Suflita, Paul A1 Moore, Chad A1 Housser, Graeme A1 McMahon, Shane A1 Puchades, Ivan PB MDPI AG YR 2024 SN 2079-9292 JF Electronics VO 13 IS 10 SP 1818 LK http://dx.doi.org/https://doi.org/10.3390/electronics13101818 DO https://doi.org/10.3390/electronics13101818 SF ELIB - SuUB Bremen
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