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1 Ergebnisse
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Analysis of the Multi-Steps Package (MSP) for Series-Connec..:
Alves, Luciano F. S.
;
Lefranc, Pierre
;
Jeannin, Pierre-Olivier
..
Electronics. 9 (2020) 9 - p. 1341 , 2020
Link:
https://doi.org/10.3390/electronics9091341
RT Journal T1
Analysis of the Multi-Steps Package (MSP) for Series-Connected SiC-MOSFETs
UL https://suche.suub.uni-bremen.de/peid=cr-10.3390_electronics9091341&Exemplar=1&LAN=DE A1 Alves, Luciano F. S. A1 Lefranc, Pierre A1 Jeannin, Pierre-Olivier A1 Sarrazin, Benoit A1 Crebier, Jean-Christophe PB MDPI AG YR 2020 SN 2079-9292 JF Electronics VO 9 IS 9 SP 1341 LK http://dx.doi.org/https://doi.org/10.3390/electronics9091341 DO https://doi.org/10.3390/electronics9091341 SF ELIB - SuUB Bremen
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