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1 Ergebnisse
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Effects of Grinding Parameters on the Processing Temperatur..:
Yan, Haipeng
;
Deng, Fei
;
Qin, Zhiying
...
Micromachines. 14 (2023) 3 - p. 666 , 2023
Link:
https://doi.org/10.3390/mi14030666
RT Journal T1
Effects of Grinding Parameters on the Processing Temperature, Crack Propagation and Residual Stress in Silicon Nitride Ceramics
UL https://suche.suub.uni-bremen.de/peid=cr-10.3390_mi14030666&Exemplar=1&LAN=DE A1 Yan, Haipeng A1 Deng, Fei A1 Qin, Zhiying A1 Zhu, Jinda A1 Chang, Hongjie A1 Niu, Huli PB MDPI AG YR 2023 SN 2072-666X JF Micromachines VO 14 IS 3 SP 666 LK http://dx.doi.org/https://doi.org/10.3390/mi14030666 DO https://doi.org/10.3390/mi14030666 SF ELIB - SuUB Bremen
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