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1 Ergebnisse
1
Research Progress of Palladium-Plated Copper Bonding Wire i..:
Zhang, Yuemin
;
Guo, Haiyun
;
Cao, Jun
...
Micromachines. 14 (2023) 8 - p. 1538 , 2023
Link:
https://doi.org/10.3390/mi14081538
RT Journal T1
Research Progress of Palladium-Plated Copper Bonding Wire in Microelectronic Packaging
UL https://suche.suub.uni-bremen.de/peid=cr-10.3390_mi14081538&Exemplar=1&LAN=DE A1 Zhang, Yuemin A1 Guo, Haiyun A1 Cao, Jun A1 Wu, Xuefeng A1 Jia, Hewei A1 Chang, Andong PB MDPI AG YR 2023 SN 2072-666X JF Micromachines VO 14 IS 8 SP 1538 LK http://dx.doi.org/https://doi.org/10.3390/mi14081538 DO https://doi.org/10.3390/mi14081538 SF ELIB - SuUB Bremen
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