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1 Ergebnisse
1
High-Q Wafer Level Package Based on Modified Tri-Layer Anod..:
Wang, Liying
;
Du, Xiaohui
;
Wang, Lingyun
...
Sensors. 17 (2017) 3 - p. 599 , 2017
Link:
https://doi.org/10.3390/s17030599
RT Journal T1
High-Q Wafer Level Package Based on Modified Tri-Layer Anodic Bonding and High Performance Getter and Its Evaluation for Micro Resonant Pressure Sensor
UL https://suche.suub.uni-bremen.de/peid=cr-10.3390_s17030599&Exemplar=1&LAN=DE A1 Wang, Liying A1 Du, Xiaohui A1 Wang, Lingyun A1 Xu, Zhanhao A1 Zhang, Chenying A1 Gu, Dandan PB MDPI AG YR 2017 SN 1424-8220 JF Sensors VO 17 IS 3 SP 599 LK http://dx.doi.org/https://doi.org/10.3390/s17030599 DO https://doi.org/10.3390/s17030599 SF ELIB - SuUB Bremen
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