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1 Ergebnisse
1
Chemical mechanical polishing for indium bond pad damascene..:
Ceulemans, Karl
;
Shafahian, Ehsan
;
Struyf, Herbert
...
Japanese Journal of Applied Physics. 63 (2024) 3 - p. 03SP39 , 2024
Link:
https://doi.org/10.35848/1347-4065/ad2135
RT Journal T1
Chemical mechanical polishing for indium bond pad damascene processing
UL https://suche.suub.uni-bremen.de/peid=cr-10.35848_1347-4065_ad2135&Exemplar=1&LAN=DE A1 Ceulemans, Karl A1 Shafahian, Ehsan A1 Struyf, Herbert A1 Devriendt, Katia A1 Deckers, Steven A1 Heylen, Nancy A1 Derakhshandeh, Jaber PB IOP Publishing YR 2024 SN 0021-4922 SN 1347-4065 JF Japanese Journal of Applied Physics VO 63 IS 3 SP 03SP39 LK http://dx.doi.org/https://doi.org/10.35848/1347-4065/ad2135 DO https://doi.org/10.35848/1347-4065/ad2135 SF ELIB - SuUB Bremen
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