I agree that this site is using cookies. You can find further informations here.
X
Merkliste 
 1 Ergebnisse 
 
1

Low-Temperature Direct Bonding of 3D-IC Packages and Power ..:

Chuang, Tung-Han ; Wu, Po-Ching ; Lai, Yu-Chang.
International Journal of Manufacturing, Materials, and Mechanical Engineering.  12 (2022)  1 - p. 1-16 , 2022
Link: https://doi.org/10.4018/ijmmme.313037