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1 Ergebnisse
1
The No-Cyanide Copper Electroplating with Dipping-Plating P..:
Tang, Xue Jiao
;
Guo, Ai Hong
;
Wang, Jin Gang
..
Advanced Materials Research. 239-242 (2011) - p. 3186-3189 , 2011
Link:
https://doi.org/10.4028/www.scientific.net/amr.239-242..
RT Journal T1 <Title>The No-Cyanide Copper Electroplating with Dipping-Plating Pretreatment</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.4028_www.scientific.net_amr.239-242.3186&Exemplar=1&LAN=DE A1 Tang, Xue Jiao A1 Guo, Ai Hong A1 Wang, Jin Gang A1 Gao, Min A1 Shen, Bo Xiong PB Trans Tech Publications, Ltd. YR 2011 SN 1662-8985 JF Advanced Materials Research VO 239-242 SP 3186 OP 3189 LK http://dx.doi.org/https://doi.org/10.4028/www.scientific.net/amr.239-242.3186 DO https://doi.org/10.4028/www.scientific.net/amr.239-242.3186 SF ELIB - SuUB Bremen
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