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1 Ergebnisse
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A New Method for the Preparation of the Copper Bonding on A..:
Lin, Hao Tung
;
Liu, Chien Cheng
;
Liu, Kuang I
Advanced Materials Research. 875-877 (2014) - p. 1495-1498 , 2014
Link:
https://doi.org/10.4028/www.scientific.net/amr.875-877..
RT Journal T1
A New Method for the Preparation of the Copper Bonding on Alumina Substrate
UL https://suche.suub.uni-bremen.de/peid=cr-10.4028_www.scientific.net_amr.875-877.1495&Exemplar=1&LAN=DE A1 Lin, Hao Tung A1 Liu, Chien Cheng A1 Liu, Kuang I PB Trans Tech Publications, Ltd. YR 2014 SN 1662-8985 JF Advanced Materials Research VO 875-877 SP 1495 OP 1498 LK http://dx.doi.org/https://doi.org/10.4028/www.scientific.net/amr.875-877.1495 DO https://doi.org/10.4028/www.scientific.net/amr.875-877.1495 SF ELIB - SuUB Bremen
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