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1 Ergebnisse
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A Novel Approach for Characterizing Epoxy Mold Compound Hig..:
Chin, Ian
;
Loh, Wei Keat
;
Bin Abdullah, Mohd Zulkifly
Journal of Microelectronics and Electronic Packaging. 20 (2023) 4 - p. , 2023
Link:
https://doi.org/10.4071/001c.91225
RT Journal T1 <Title>A Novel Approach for Characterizing Epoxy Mold Compound High Temperature Swelling</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.4071_001c.91225&Exemplar=1&LAN=DE A1 Chin, Ian A1 Loh, Wei Keat A1 Bin Abdullah, Mohd Zulkifly PB IMAPS - International Microelectronics Assembly and Packaging Society YR 2023 SN 1551-4897 JF Journal of Microelectronics and Electronic Packaging VO 20 IS 4 LK http://dx.doi.org/https://doi.org/10.4071/001c.91225 DO https://doi.org/10.4071/001c.91225 SF ELIB - SuUB Bremen
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