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Novel Wiring Structure for 3D-Conformable Devices:
Sawada, Susumu
;
Tomita, Yoshihiro
;
Hirano, Koichi
...
Transactions of The Japan Institute of Electronics Packaging. 10 (2017) 0 - p. E16-017-1-E16-017-6 , 2017
Link:
https://doi.org/10.5104/jiepeng.10.e16-017-1
RT Journal T1 <Title>Novel Wiring Structure for 3D-Conformable Devices</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.5104_jiepeng.10.e16-017-1&Exemplar=1&LAN=DE A1 Sawada, Susumu A1 Tomita, Yoshihiro A1 Hirano, Koichi A1 Morita, Hiromi A1 Ohmae, Hideki A1 Ichiryu, Takashi A1 Nomura, Masanori A1 Kawakita, Koji PB Japan Institute of Electronics Packaging YR 2017 SN 1883-3365 SN 1884-8028 JF Transactions of The Japan Institute of Electronics Packaging VO 10 IS 0 SP E16 OP 017-1-E16-017-6 LK http://dx.doi.org/https://doi.org/10.5104/jiepeng.10.e16-017-1 DO https://doi.org/10.5104/jiepeng.10.e16-017-1 SF ELIB - SuUB Bremen
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