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1 Ergebnisse
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Application of Die Molding Technology to Antenna Developmen:
Maeda, Atsushi
Transactions of The Japan Institute of Electronics Packaging. 10 (2017) 0 - p. E17-009-1-E17-009-10 , 2017
Link:
https://doi.org/10.5104/jiepeng.10.e17-009-1
RT Journal T1 <Title>Application of Die Molding Technology to Antenna Development</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.5104_jiepeng.10.e17-009-1&Exemplar=1&LAN=DE A1 Maeda, Atsushi PB Japan Institute of Electronics Packaging YR 2017 SN 1883-3365 SN 1884-8028 JF Transactions of The Japan Institute of Electronics Packaging VO 10 IS 0 SP E17 OP 009-1-E17-009-10 LK http://dx.doi.org/https://doi.org/10.5104/jiepeng.10.e17-009-1 DO https://doi.org/10.5104/jiepeng.10.e17-009-1 SF ELIB - SuUB Bremen
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