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Configuration for High-speed Transmission between Flip-chip..:

Akahoshi, Tomoyuki ; Mizutani, Daisuke ; Sugimoto, Kaoru..
Transactions of The Japan Institute of Electronics Packaging.  11 (2018)  0 - p. E17-016-1-E17-016-6 , 2018
Link: https://doi.org/10.5104/jiepeng.11.e17-016-1