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Bonding Strength of Cu Sinter Die-Bonding Paste on Ni, Cu, ..:

Ishikawa, Dai ; An, Bao Ngoc ; Mail, Matthias...
Transactions of The Japan Institute of Electronics Packaging.  13 (2020)  0 - p. E19-017-1-E19-017-11 , 2020
Link: https://doi.org/10.5104/jiepeng.13.e19-017-1