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Bonding Abilities of Pressure-assisted Sintered Copper for ..:
Ishikawa, Dai
;
An, Bao Ngoc
;
Mail, Matthias
...
Transactions of The Japan Institute of Electronics Packaging. 13 (2020) 0 - p. E20-003-1-E20-003-3 , 2020
Link:
https://doi.org/10.5104/jiepeng.13.e20-003-1
RT Journal T1 <Title>Bonding Abilities of Pressure-assisted Sintered Copper for Die-Bonding of Large Chips</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.5104_jiepeng.13.e20-003-1&Exemplar=1&LAN=DE A1 Ishikawa, Dai A1 An, Bao Ngoc A1 Mail, Matthias A1 Wurst, Helge A1 Leyrer, Benjamin A1 Blank, Thomas A1 Weber, Marc A1 Nakako, Hideo PB Japan Institute of Electronics Packaging YR 2020 SN 1883-3365 SN 1884-8028 JF Transactions of The Japan Institute of Electronics Packaging VO 13 IS 0 SP E20 OP 003-1-E20-003-3 LK http://dx.doi.org/https://doi.org/10.5104/jiepeng.13.e20-003-1 DO https://doi.org/10.5104/jiepeng.13.e20-003-1 SF ELIB - SuUB Bremen
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