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1 Ergebnisse
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QFP/quartz Adhesive Bonding with Surface Treatment for Phys..:
Nodaka, Hiro
;
Tezuka, Ami
;
Kuwae, Hiroyuki
...
Transactions of The Japan Institute of Electronics Packaging. 13 (2020) 0 - p. E20-008-1-E20-008-4 , 2020
Link:
https://doi.org/10.5104/jiepeng.13.e20-008-1
RT Journal T1 <Title>QFP/quartz Adhesive Bonding with Surface Treatment for Physical Security of Edge Artificial Intelligence Devices</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.5104_jiepeng.13.e20-008-1&Exemplar=1&LAN=DE A1 Nodaka, Hiro A1 Tezuka, Ami A1 Kuwae, Hiroyuki A1 Yamada, Kosuke A1 Hoga, Morihisa A1 Shimamoto, Haruo A1 Shoji, Shuichi A1 Mizuno, Jun PB Japan Institute of Electronics Packaging YR 2020 SN 1883-3365 SN 1884-8028 JF Transactions of The Japan Institute of Electronics Packaging VO 13 IS 0 SP E20 OP 008-1-E20-008-4 LK http://dx.doi.org/https://doi.org/10.5104/jiepeng.13.e20-008-1 DO https://doi.org/10.5104/jiepeng.13.e20-008-1 SF ELIB - SuUB Bremen
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