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1 Ergebnisse
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Development of Long and High-Density Flexible Printed Circu..:
Kondo, Takashi
;
Fujiwara, Kohei
;
Hachiya, Takashi
...
Transactions of The Japan Institute of Electronics Packaging. 15 (2022) 0 - p. E21-007-1-E21-007-10 , 2022
Link:
https://doi.org/10.5104/jiepeng.15.e21-007-1
RT Journal T1 <Title>Development of Long and High-Density Flexible Printed Circuits</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.5104_jiepeng.15.e21-007-1&Exemplar=1&LAN=DE A1 Kondo, Takashi A1 Fujiwara, Kohei A1 Hachiya, Takashi A1 Imai, Hikaru A1 Morita, Miu A1 Nakagawa, Itaru A1 Sato, Naoyuki A1 Tsuruta, Masato A1 Yanagawa, Daisuke PB Japan Institute of Electronics Packaging YR 2022 SN 1883-3365 SN 1884-8028 JF Transactions of The Japan Institute of Electronics Packaging VO 15 IS 0 SP E21 OP 007-1-E21-007-10 LK http://dx.doi.org/https://doi.org/10.5104/jiepeng.15.e21-007-1 DO https://doi.org/10.5104/jiepeng.15.e21-007-1 SF ELIB - SuUB Bremen
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