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1 Ergebnisse
1
Silicon-Photonics-Embedded Interposers as Co-Packaged Optic..:
Takemura, Koichi
;
Ohshima, Daisuke
;
Noriki, Akihiro
...
Transactions of The Japan Institute of Electronics Packaging. 15 (2022) 0 - p. E21-012-1-E21-012-13 , 2022
Link:
https://doi.org/10.5104/jiepeng.15.e21-012-1
RT Journal T1 <Title>Silicon-Photonics-Embedded Interposers as Co-Packaged Optics Platform</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.5104_jiepeng.15.e21-012-1&Exemplar=1&LAN=DE A1 Takemura, Koichi A1 Ohshima, Daisuke A1 Noriki, Akihiro A1 Okamoto, Daisuke A1 Ukita, Akio A1 Ushida, Jun A1 Tokushima, Masatoshi A1 Shimizu, Takanori A1 Ogura, Ichiro A1 Shimura, Daisuke A1 Aoki, Tsuyoshi A1 Amano, Takeru A1 Nakamura, Takahiro PB Japan Institute of Electronics Packaging YR 2022 SN 1883-3365 SN 1884-8028 JF Transactions of The Japan Institute of Electronics Packaging VO 15 IS 0 SP E21 OP 012-1-E21-012-13 LK http://dx.doi.org/https://doi.org/10.5104/jiepeng.15.e21-012-1 DO https://doi.org/10.5104/jiepeng.15.e21-012-1 SF ELIB - SuUB Bremen
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