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1 Ergebnisse
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Thermal Characterization of a Three-Dimensional (3D) Chip S..:
Matsumoto, Keiji
;
Taira, Yoichi
Transactions of The Japan Institute of Electronics Packaging. 2 (2009) 1 - p. 153-159 , 2009
Link:
https://doi.org/10.5104/jiepeng.2.153
RT Journal T1 <Title>Thermal Characterization of a Three-Dimensional (3D) Chip Stack</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.5104_jiepeng.2.153&Exemplar=1&LAN=DE A1 Matsumoto, Keiji A1 Taira, Yoichi PB Japan Institute of Electronics Packaging YR 2009 SN 1884-8028 SN 1883-3365 JF Transactions of The Japan Institute of Electronics Packaging VO 2 IS 1 SP 153 OP 159 LK http://dx.doi.org/https://doi.org/10.5104/jiepeng.2.153 DO https://doi.org/10.5104/jiepeng.2.153 SF ELIB - SuUB Bremen
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