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Large-Area Chip Attachment by Sintering Nanosilver Paste: P..:

Xiao, Kewei ; Calata, Jesus ; Ngo, Khai..
Transactions of The Japan Institute of Electronics Packaging.  4 (2011)  1 - p. 101-109 , 2011
Link: https://doi.org/10.5104/jiepeng.4.101