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Bonding Pad Fabrication for Printed Electronics Using Silve..:

Nakatani, Makoto ; Nakajo, Haruyuki ; Saito, Hiroshi..
Transactions of The Japan Institute of Electronics Packaging.  6 (2013)  1 - p. 99-103 , 2013
Link: https://doi.org/10.5104/jiepeng.6.99