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1 Ergebnisse
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Multilayered Sn/Ag3Sn Electroplating on Cu Alloys for High ..:
Kure-Chu, Song-Zhu
;
Ogasawara, Tohru
;
Yashiro, Hitoshi
...
Transactions of The Japan Institute of Electronics Packaging. 7 (2014) 1 - p. 79-86 , 2014
Link:
https://doi.org/10.5104/jiepeng.7.79
RT Journal T1 <Title>Multilayered Sn/Ag3Sn Electroplating on Cu Alloys for High Reliable Electronic/Electric Materials</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.5104_jiepeng.7.79&Exemplar=1&LAN=DE A1 Kure-Chu, Song-Zhu A1 Ogasawara, Tohru A1 Yashiro, Hitoshi A1 Ye, Rongbin A1 Hosokai, Takuya A1 Uchidate, Michimasa A1 Suziki, Eiichi A1 Naito, Tomoyuki PB Japan Institute of Electronics Packaging YR 2014 SN 1883-3365 SN 1884-8028 JF Transactions of The Japan Institute of Electronics Packaging VO 7 IS 1 SP 79 OP 86 LK http://dx.doi.org/https://doi.org/10.5104/jiepeng.7.79 DO https://doi.org/10.5104/jiepeng.7.79 SF ELIB - SuUB Bremen
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