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Reliability Evaluation for Integrated Glass Interposer:

Lee, Ching-Kuan ; Wang, Jen-Chun ; Chang, Hsiang-Hung.
Transactions of The Japan Institute of Electronics Packaging.  9 (2016)  0 - p. E16-009-1-E16-009-5 , 2016
Link: https://doi.org/10.5104/jiepeng.9.e16-009-1