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Packaging Material Evaluation for 2.5D/3D TSV Application:
Mitsukura, Kazuyuki
;
Makino, Tatsuya
;
Hatakeyama, Keiichi
...
Transactions of The Japan Institute of Electronics Packaging. 9 (2016) 0 - p. E16-011-1-E16-011-7 , 2016
Link:
https://doi.org/10.5104/jiepeng.9.e16-011-1
RT Journal T1 <Title>Packaging Material Evaluation for 2.5D/3D TSV Application</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.5104_jiepeng.9.e16-011-1&Exemplar=1&LAN=DE A1 Mitsukura, Kazuyuki A1 Makino, Tatsuya A1 Hatakeyama, Keiichi A1 Rebibis, Kenneth June A1 Wang, Teng A1 Capuz, Giovanni A1 Duval, Fabrice A1 Detalle, Mikael A1 Miller, Andy A1 Beyne, Eric PB Japan Institute of Electronics Packaging YR 2016 SN 1883-3365 SN 1884-8028 JF Transactions of The Japan Institute of Electronics Packaging VO 9 IS 0 SP E16 OP 011-1-E16-011-7 LK http://dx.doi.org/https://doi.org/10.5104/jiepeng.9.e16-011-1 DO https://doi.org/10.5104/jiepeng.9.e16-011-1 SF ELIB - SuUB Bremen
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