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1 Ergebnisse
1
Millimeter-Wave Flip-Chip Bonding for On-BoardMeasurement:
Kim, Ju-Won
;
Min, Byung-Wook
The Journal of Korean Institute of Electromagnetic Engineering andScience. 34 (2023) 4 - p. 273-276 , 2023
Link:
https://doi.org/10.5515/kjkiees.2023.34.4.273
RT Journal T1 <Title>Millimeter-Wave Flip-Chip Bonding for On-BoardMeasurement</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.5515_kjkiees.2023.34.4.273&Exemplar=1&LAN=DE A1 Kim, Ju-Won A1 Min, Byung-Wook PB Korean Institute of Electromagnetic Engineering and Science YR 2023 SN 1226-3133 SN 2288-226X JF The Journal of Korean Institute of Electromagnetic Engineering andScience VO 34 IS 4 SP 273 OP 276 LK http://dx.doi.org/https://doi.org/10.5515/kjkiees.2023.34.4.273 DO https://doi.org/10.5515/kjkiees.2023.34.4.273 SF ELIB - SuUB Bremen
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