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1 Ergebnisse
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Cu CMP process development and characterization of Cu dishi..:
Hu, Zheng-Jun
;
Qu, Xin-Ping
;
Lin, Hong
...
Japanese Journal of Applied Physics. 58 (2019) SH - p. SHHC01 , 2019
Link:
https://doi.org/10.7567/1347-4065/ab17c4
RT Journal T1 <Title>Cu CMP process development and characterization of Cu dishing with 1.8 μm Cu pad and 3.6 μm pitch in Cu/SiO2 hybrid bonding</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.7567_1347-4065_ab17c4&Exemplar=1&LAN=DE A1 Hu, Zheng-Jun A1 Qu, Xin-Ping A1 Lin, Hong A1 Huang, Ren-Dong A1 Ge, Xing-Chen A1 Li, Ming A1 Chen, Shou-Mian A1 Zhao, Yu-Hang PB IOP Publishing YR 2019 SN 0021-4922 SN 1347-4065 JF Japanese Journal of Applied Physics VO 58 IS SH SP SHHC01 LK http://dx.doi.org/https://doi.org/10.7567/1347-4065/ab17c4 DO https://doi.org/10.7567/1347-4065/ab17c4 SF ELIB - SuUB Bremen
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