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1 Ergebnisse
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300 mm wafer-level hybrid bonding for Cu/interlayer dielect..:
Fujino, Masahisa
;
Takahashi, Kenji
;
Araga, Yuuki
.
Japanese Journal of Applied Physics. 59 (2019) SB - p. SBBA02 , 2019
Link:
https://doi.org/10.7567/1347-4065/ab4b2b
RT Journal T1
300 mm wafer-level hybrid bonding for Cu/interlayer dielectric bonding in vacuum
UL https://suche.suub.uni-bremen.de/peid=cr-10.7567_1347-4065_ab4b2b&Exemplar=1&LAN=DE A1 Fujino, Masahisa A1 Takahashi, Kenji A1 Araga, Yuuki A1 Kikuchi, Katsuya PB IOP Publishing YR 2019 SN 0021-4922 SN 1347-4065 JF Japanese Journal of Applied Physics VO 59 IS SB SP SBBA02 LK http://dx.doi.org/https://doi.org/10.7567/1347-4065/ab4b2b DO https://doi.org/10.7567/1347-4065/ab4b2b SF ELIB - SuUB Bremen
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