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1 Ergebnisse
1
Transient Thermal Analysis of System-in-Package Technology ..:
, In:
2022 International Conference on Microelectronics (ICM)
,
Oukaira, Aziz
;
Said, Dhaou
;
Zbitou, Jamal
. - p. 30-33 , 2022
Link:
https://doi.org/10.1109/ICM56065.2022.10005514
RT T1 <cTitle>2022 International Conference on Microelectronics (ICM)</cTitle>: T1 <Title>Transient Thermal Analysis of System-in-Package Technology by the Finite Element Method (FEM)</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10005514&Exemplar=1&LAN=DE A1 Oukaira, Aziz A1 Said, Dhaou A1 Zbitou, Jamal A1 Lakhssassi, Ahmed YR 2022 K1 Heating systems K1 Analytical models K1 System-in-package K1 Packaging K1 Thermal conductivity K1 Thermal management K1 Thermal analysis K1 Finite Element Method (FEM) K1 System-In-Package (SiP) K1 transient thermal K1 thermal management SP 30 OP 33 LK http://dx.doi.org/https://doi.org/10.1109/ICM56065.2022.10005514 DO https://doi.org/10.1109/ICM56065.2022.10005514 SF ELIB - SuUB Bremen
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