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Study on Warpage of Interposer by Chip Distribution:

, In: 2022 7th International Conference on Integrated Circuits and Microsystems (ICICM),
He, Yimin ; Lu, Xiangjun ; Bao, Shuchao... - p. 149-152 , 2022
Link: https://doi.org/10.1109/ICICM56102.2022.10011298