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Stress-Free Thin Die-Level De-bonding for 2.5D, 3DIC Packag..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Shin, Yongchul ; Kang, Sujie ; Park, Sun-Woo... - p. 179-182 , 2022
Link: https://doi.org/10.1109/EPTC56328.2022.10013107