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1 Ergebnisse
1
700nm pitch Cu/SiCN wafer-to-wafer hybrid bonding:
, In:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
,
Chew, Soon-Aik
;
Iacovo, Serena
;
Fordor, Ferenc
... - p. 334-337 , 2022
Link:
https://doi.org/10.1109/EPTC56328.2022.10013108
RT T1
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
: T1
700nm pitch Cu/SiCN wafer-to-wafer hybrid bonding
UL https://suche.suub.uni-bremen.de/peid=ieee-10013108&Exemplar=1&LAN=DE A1 Chew, Soon-Aik A1 Iacovo, Serena A1 Fordor, Ferenc A1 Dewilde, Sven A1 Devriendt, Katia A1 De Vos, Joeri A1 Miller, Andy A1 Beyer, Gerald A1 Beyne, Eric YR 2022 K1 Atomic measurements K1 Resistors K1 Performance evaluation K1 Kelvin K1 Machine learning K1 Metrology K1 Surface roughness K1 W2W hybrid bonding K1 AFM K1 PAD pitch 700nm SP 334 OP 337 LK http://dx.doi.org/https://doi.org/10.1109/EPTC56328.2022.10013108 DO https://doi.org/10.1109/EPTC56328.2022.10013108 SF ELIB - SuUB Bremen
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