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700nm pitch Cu/SiCN wafer-to-wafer hybrid bonding:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Chew, Soon-Aik ; Iacovo, Serena ; Fordor, Ferenc... - p. 334-337 , 2022
Link: https://doi.org/10.1109/EPTC56328.2022.10013108