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Die Tilt Improvement Through Copper Spacers in Solder Paste..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Santican, Haima ; Dchar, Ilyas ; Yandoc, Ding.. - p. 1-5 , 2022
Link: https://doi.org/10.1109/EPTC56328.2022.10013113