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Wafer Level Package with Polymer Sealed Air Cavity:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Ho, Soon Wee ; Siew Boon, Serine Soh ; Long, Lau Boon. - p. 598-602 , 2022
Link: https://doi.org/10.1109/EPTC56328.2022.10013118