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Double Mold Fan-Out Wafer Level Packaging for AiP Applicati..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Long, Lau Boon ; Ho, David ; Guan, Lim Teck.. - p. 01-06 , 2022
Link: https://doi.org/10.1109/EPTC56328.2022.10013125