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1 Ergebnisse
1
Modifying of Tin based solder composition with optimized Bi..:
, In:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
,
Son, J.Y.
;
Lee, S.G.
;
Park, J.W.
.. - p. 01-05 , 2022
Link:
https://doi.org/10.1109/EPTC56328.2022.10013126
RT T1
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
: T1
Modifying of Tin based solder composition with optimized Bi, Ni and Cu contents for high TC and drop shock reliability
UL https://suche.suub.uni-bremen.de/peid=ieee-10013126&Exemplar=1&LAN=DE A1 Son, J.Y. A1 Lee, S.G. A1 Park, J.W. A1 Lee, Y.W. A1 Jung, S.B. YR 2022 K1 Precipitation K1 Electric shock K1 Thermal shock K1 Crystals K1 Tin K1 Lead K1 Nickel SP 01 OP 05 LK http://dx.doi.org/https://doi.org/10.1109/EPTC56328.2022.10013126 DO https://doi.org/10.1109/EPTC56328.2022.10013126 SF ELIB - SuUB Bremen
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