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Modifying of Tin based solder composition with optimized Bi..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Son, J.Y. ; Lee, S.G. ; Park, J.W... - p. 01-05 , 2022
Link: https://doi.org/10.1109/EPTC56328.2022.10013126