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A Comprehensive Study on Die Strength and Impact on Package..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Maw, HLA Phone ; Luan, Jing-en ; Goh, Kim Yong. - p. 716-718 , 2022
Link: https://doi.org/10.1109/EPTC56328.2022.10013137