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1 Ergebnisse
1
Solder Joint Reliability Assessment on FO-CSP for Next Gene..:
, In:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
,
Liu, Vance
;
Chen, Jian-Ming
;
Pan, Ji-An
... - p. 969-972 , 2022
Link:
https://doi.org/10.1109/EPTC56328.2022.10013142
RT T1 <cTitle>2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)</cTitle>: T1 <Title>Solder Joint Reliability Assessment on FO-CSP for Next Generation DDR6</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10013142&Exemplar=1&LAN=DE A1 Liu, Vance A1 Chen, Jian-Ming A1 Pan, Ji-An A1 Sinha, Koustav A1 Gan, CL A1 Yoo, Chan A1 Takiar, Hem YR 2022 K1 Legged locomotion K1 Thermal expansion K1 Electronic packaging thermal management K1 Neck K1 Reliability K1 Soldering K1 Thermal stresses K1 Solder-joint reliability K1 Fan-out chip scale package (FO-CSP) K1 redistributed layer (RDL) K1 coefficient of thermal expansion (CTE) SP 969 OP 972 LK http://dx.doi.org/https://doi.org/10.1109/EPTC56328.2022.10013142 DO https://doi.org/10.1109/EPTC56328.2022.10013142 SF ELIB - SuUB Bremen
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