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1 Ergebnisse
1
Thin Memory Chip Fabrication for Multi-stack Hybrid Bonding..:
, In:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
,
Sekhar, V. N.
;
Mishra, Dileep Kumar
;
Choong, Chong Ser
. - p. 589-593 , 2022
Link:
https://doi.org/10.1109/EPTC56328.2022.10013147
RT T1
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
: T1
Thin Memory Chip Fabrication for Multi-stack Hybrid Bonding Applications
UL https://suche.suub.uni-bremen.de/peid=ieee-10013147&Exemplar=1&LAN=DE A1 Sekhar, V. N. A1 Mishra, Dileep Kumar A1 Choong, Chong Ser A1 Rao, Vempati Srinivasa YR 2022 K1 Fabrication K1 Three-dimensional displays K1 Stacking K1 Dielectric materials K1 Bandwidth K1 Packaging K1 Routing K1 Thin Wafer Handling K1 Cu Damascene Processes K1 Hybrid bonding K1 Memory Chip Stacking SP 589 OP 593 LK http://dx.doi.org/https://doi.org/10.1109/EPTC56328.2022.10013147 DO https://doi.org/10.1109/EPTC56328.2022.10013147 SF ELIB - SuUB Bremen
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