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Thin Memory Chip Fabrication for Multi-stack Hybrid Bonding..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Sekhar, V. N. ; Mishra, Dileep Kumar ; Choong, Chong Ser. - p. 589-593 , 2022
Link: https://doi.org/10.1109/EPTC56328.2022.10013147