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1 Ergebnisse
1
The Impact of Environment Humidity on WS Paste Characterist..:
, In:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
,
Fen, Zhang Rui
;
Jason, Lim Chze Min
;
Huei, Yam Lip
... - p. 486-489 , 2022
Link:
https://doi.org/10.1109/EPTC56328.2022.10013151
RT T1 <cTitle>2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)</cTitle>: T1 <Title>The Impact of Environment Humidity on WS Paste Characteristics</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10013151&Exemplar=1&LAN=DE A1 Fen, Zhang Rui A1 Jason, Lim Chze Min A1 Huei, Yam Lip A1 Kumar, Balasubramanian Senthil A1 Murali, Sarangapani A1 Wen, Zhang Han A1 Sungsig, SS Kang A1 Li-San, Chan YR 2022 K1 Viscosity K1 Water K1 Powders K1 Rheology K1 Atmosphere K1 Humidity K1 Substrates K1 Water soluble K1 solder paste K1 environment humidity K1 solder ability K1 rheology K1 viscosity SP 486 OP 489 LK http://dx.doi.org/https://doi.org/10.1109/EPTC56328.2022.10013151 DO https://doi.org/10.1109/EPTC56328.2022.10013151 SF ELIB - SuUB Bremen
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