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1 Ergebnisse
1
Demonstration of 50 nm Overlay Accuracy for Wafer-to-Wafer ..:
, In:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
,
Mitsuishi, Hajime
;
Mori, Hiroshi
;
Maeda, Hidehiro
... - p. 338-343 , 2022
Link:
https://doi.org/10.1109/EPTC56328.2022.10013152
RT T1 <cTitle>2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)</cTitle>: T1 <Title>Demonstration of 50 nm Overlay Accuracy for Wafer-to-Wafer Bonding and Further Improvement Study</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10013152&Exemplar=1&LAN=DE A1 Mitsuishi, Hajime A1 Mori, Hiroshi A1 Maeda, Hidehiro A1 Ushijima, Mikio A1 Aramata, Masanori A1 Fukuda, Minoru A1 Okada, Masashi A1 Kanbayashi, Masahiro A1 Shimoda, Toshimasa A1 Sugaya, Isao YR 2022 K1 Wafer bonding K1 Semiconductor device modeling K1 Performance evaluation K1 Mass production K1 Lithography K1 Distortion K1 Distortion measurement SP 338 OP 343 LK http://dx.doi.org/https://doi.org/10.1109/EPTC56328.2022.10013152 DO https://doi.org/10.1109/EPTC56328.2022.10013152 SF ELIB - SuUB Bremen
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