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1
Evaluation of Polymer Materials for Hybrid Bonding Applicat..:
, In:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
,
Mishra, Dileep Kumar
;
Sekhar, V. N.
;
Choong, Chong Ser
. - p. 357-360 , 2022
Link:
https://doi.org/10.1109/EPTC56328.2022.10013162
RT T1
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
: T1
Evaluation of Polymer Materials for Hybrid Bonding Application
UL https://suche.suub.uni-bremen.de/peid=ieee-10013162&Exemplar=1&LAN=DE A1 Mishra, Dileep Kumar A1 Sekhar, V. N. A1 Choong, Chong Ser A1 Rao, Vempati Srinivasa YR 2022 K1 Dielectric materials K1 Stacking K1 Multichip modules K1 Curing K1 Surface roughness K1 Dielectric measurement K1 Rough surfaces K1 Polymer dielectric K1 hybrid bonding K1 CMP K1 roughness K1 shear strength SP 357 OP 360 LK http://dx.doi.org/https://doi.org/10.1109/EPTC56328.2022.10013162 DO https://doi.org/10.1109/EPTC56328.2022.10013162 SF ELIB - SuUB Bremen
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