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Evaluation of Polymer Materials for Hybrid Bonding Applicat..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Mishra, Dileep Kumar ; Sekhar, V. N. ; Choong, Chong Ser. - p. 357-360 , 2022
Link: https://doi.org/10.1109/EPTC56328.2022.10013162